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[Seminar Title : RELIABILITY STUDY OF SnPb AND SnAg SOLDER JOINTS IN PBGA PACKAGES]

 

  * Title: RELIABILITY STUDY OF SnPb AND SnAg SOLDER JOINTS IN PBGA PACKAGES

    *   Speaker: Ph.D. Dong Hyun Kim (실리콘밸리 Cisco Systems, Inc.)

    *   Date & Time:25 November(wed) 14:00~16:00

    *   Where: N7 Building #3213 (기계동 동관 3층 건물 입니다)