물리학과
2009-11-23 11:20:38
0
45141
[Seminar Title : RELIABILITY STUDY OF SnPb AND SnAg SOLDER JOINTS IN PBGA PACKAGES]
* Title: RELIABILITY STUDY OF SnPb AND SnAg SOLDER JOINTS IN PBGA PACKAGES
* Speaker: Ph.D. Dong Hyun Kim (실리콘밸리 Cisco Systems, Inc.)
* Date & Time:25 November(wed) 14:00~16:00
* Where: N7 Building #3213 (기계동 동관 3층 건물 입니다)